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DesignCon 2012 : Samtec to Present SI Fusion and Technical Paper .
Samtec, Inc. will participate in the DesignCon 2012 conference and exhibition featuring SI Fusion, end-to-end interconnect solutions that make your entire system faster, thinner and lighter, across longer distances with lower overall costs. Samtec will also be presenting a 40-minute technical paper on connector model validation techniques for improved signal integrity.
Samtec’s line of high speed, high density SEARAY™ open pin field arrays maximize grounding and routing flexibility and feature Edge Rate™ contacts optimized for signal integrity. The .050” (1,27mm) pitch system is available with up to 500 I/Os in stack heights from 4mm to 40mm. A right angle version is available for micro backplane applications, and a press fit tail option provides greater system flexibility. The latest 0,80mm (.0315”) pitch system offers up to a 50 percent board space savings with 7mm and 10mm stack heights. A low profile version is currently in development.
High speed 0,80mm (.0315”) pitch Q Rate® connector strips feature an industry standard ground/power plane that allows the Edge Rate™ contacts to be placed closer together without degrading signal performance. The result is a slim 5mm body design to help minimize PCB real estate for limited space applications. The QRF8/QRM8 Series is available with up to 156 I/Os in 7mm and 10mm stack heights.
In addition, Samtec’s new QSFP+ Active Optical Cable System features an optical engine that significantly outperforms traditional copper cables in bandwidth, distance and cable density. The optical engine converts electrical signal to optical with four channels transmitting an aggregate bandwidth of 40 or 56 Gbps. The QSFPO Series lightweight cable system meets QSFP MSA form-factor specifications, is compliant to Infiniband and Ethernet protocols, and features a small 3mm diameter cable with lengths up to 100 meters. A complete Active Optical Cable System of engines, jumpers, and assemblies is in development for PCIe® Gen 1, 2, and 3 applications.
Visit Samtec at Booth 215 or http://www.samtec.com/designcon to see how signal integrity products, services and tools intersect with Samtec SI Fusion.
Email:
Asia – singapore@samtec.com
Australia – australia@samtec.com
France – france@samtec.com
Germany – germany@samtec.com
United States – info@samtec.com
United Kingdom – scotland@samtec.com
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