Renault Samsung Motors and POSCO steel ink deal to produce next ROGUE SUV.

WorldWide Tech & Science. Francisco De Jesùs.

 

Renault Samsung Motors and POSCO steel ink deal to produce next ROGUE SUV.

Renault Samsung Motors, the Korean unit of French automaker Renault SA, said Friday it has signed an agreement with steel giant POSCO to step up cooperation in producing the popular sports utility vehicle Rogue at its local plant.

Under the memorandum of understanding, POSCO will provide Renault Samsung with steel plates to be used for Nissan’s next generation Rogue SUV at its factory in Busan, said the carmaker.

POSCO will also participate in Renault Samsung’s Rogue production project from the beginning in order to produce quality equipment fit for the vehicle as part of the early vendor involvement program, the company added.

“The two companies have established a foothold for the steady partnership,” said Renault Samsung in a statement.

“We are seeking further business cooperation with other companies to produce the Rogue.” Renault Group has decided to share its South Korean unit’s production line with Nissan, with the next generation Rogue model to be produced from October 2014. The Nissan vehicle will be shipped to North America instead of selling in South Korea, according to Renault Samsung.

South Korea’s fourth-largest carmaker has suffered a sharp drop in sales for months, with 116,606 vehicles sold in the first nine months of the year, down 39.7 percent from a year earlier.

It also accepted voluntary retirement from 800 workers last month in a bid to cut labor costs.

2013: DDR4 RAMs might come sooner than DDR3s did.

WorldWide Tech & Science. Francisco De Jesús.

2013: DDR4 RAMs might come sooner than DDR3s did.

DDR3 memory seems to last quite long now as the unchallenged memory standard. As DDR4 finally makes the inroads in 2014,

Samsung wants DDR4 out sooner than 2014. DDR3 are just not profitable anymore because of their very low prices. 

In fact, Samsung already has a DDR4 UDIMM. The product was revealed back in January 2011.

Going from DDR2 to DDR3 took three years. Samsung, and Hynix, hope for the transition from DDR3 to DDR4 to be completed faster. 

DDR4 will bring along even higher bandwidth, but accompanied with higher latency settings. 

This problem might impact the desktop and workstation benchmarks at the early stage, however, just as with DDR3, more optimised dies should appear over time.

On the other hand, its further power savings should help in the adoption. 

Companies like Samsung and Hynix are expecting samples of higher speed DDR4 chips this year, with high density 4 Gbit dies following next year. But, again, any real deployment has to wait till 2014, when at least some Intel and AMD platforms are expected to support the new memory.